Description
As mobile broadcasting and entertainment applications evolve, there is increasing interest in 3D graphics within the field of mobile electronics, particularly for handheld devices. In Mobile 3D Graphics SoC, Yoo provides a comprehensive understanding of the algorithms of mobile 3D graphics and their real chip implementation methods. 3D graphics SoC (System on a Chip) architecture and its interaction with embedded system software are explained with numerous examples. Yoo divides the book into three sections: general methodology of low power SoC, design of low power 3D graphics SoC, and silicon implementation of 3D graphics SoCs and their application to mobile electronics. Full examples are presented at various levels such as system level design and circuit level optimization along with design technology. Yoo incorporates many real chip examples, including many commercial 3D graphics chips, and provides cross-comparisons of various architectures and their performance. Furthermore, while advanced 3D graphics techniques are well understood and supported by industry standards, this is less true in the emerging mobile applications and games market. This book redresses this imbalance, providing an in-depth look at the new OpenGL ES (The Standard for Embedded Accelerated 3D Graphics), and shows what these new embedded systems graphics libraries can provide for 3D graphics and games developers.
About the Author
Hoi Jun Yoo is a Professor of Electrical Engineering at the Korea Advanced Institute of Science and Technology (KAIST) and currently serves as Project Manager for the Korea Ministry of Information and Communication's IT SoC and Post-PC programs. Yoo's industry experience includes time with Bell Communications Research in Red Bank, NJ, where he invented the two-dimensional phase-locked VCSEL array, the front-surface-emitting laser, and the high-speed lateral HBT, as well as an appointment as Manager of a DRAM design group at Hyundai Electronics. He has written popular Korean books on DRAM design and high performance DRAM, and in 1994 received the Electronic Industrial Association of Korea Award for his contribution to DRAM technology, along with the Korea Semiconductor Industry Association Award in 2002. Yoo is the founder the System Integration and IP Authoring Research Center (SIPAC), a national-level center funded by the Korean government. Yoo holds a B.S. in Electronic Engineering from Seoul National University and an M.S. and Ph.D degrees in Electrical Engineering from KAIST.
Jeong-Ho Woo is a PhD candidate at KAIST. Ju-Ho Sohn works at LG Electronics, and Byung-Gyu Nam works for Samsung.
Book Information
ISBN 9780470823774
Author Hoi-Jun Yoo
Format Hardback
Page Count 352
Imprint Wiley-IEEE Press
Publisher John Wiley & Sons Inc
Weight(grams) 744g
Dimensions(mm) 252mm * 174mm * 23mm
