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Integrated Circuit Packaging, Assembly and Interconnections by William J. Greig 9780387281537
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Integrated Circuit Packaging, Assembly and Interconnections by William J. Greig 9780387281537

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Description

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

Book Information
ISBN 9780387281537
Author William J. Greig
Format Hardback
Page Count 300
Imprint Springer-Verlag New York Inc.
Publisher Springer-Verlag New York Inc.
Weight(grams) 1400g

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