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Wireless Interface Technologies for 3D IC and Module Integration by Tadahiro Kuroda 9781108841214

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Description

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Synthesising fifteen years of research, this text provides a comprehensive treatment of two major technologies for wireless chip and module interface design.

Book Information
ISBN 9781108841214
Author Tadahiro Kuroda
Format Hardback
Page Count 336
Imprint Cambridge University Press
Publisher Cambridge University Press
Weight(grams) 752g
Dimensions(mm) 251mm * 177mm * 24mm

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