Description
Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.
About the Author
Book Information
ISBN 9780471591672
Author Michael G. Pecht
Format Hardback
Page Count 312
Imprint Wiley-Interscience
Publisher John Wiley & Sons Inc
Weight(grams) 549g
Dimensions(mm) 221mm * 158mm * 23mm
About the Author
Michael Pecht is a tenured faculty member with a joint appointment in Systems Research and Mechanical Engineering, and the Director of the CALCE Electronic Packaging Research Center at the University of Maryland. He has an MS in electrical engineering and an MS and PhD in engineering mechanics from the University of Wisconsin. He is a Professional Engineer and an IEEE Fellow. He serves on the board of advisors for various companies and was a West-inghouse Professor. He is the chief editor of the IEEE Transactions on Reliability, and a section editor for the Society of Automotive Engineering.
Book Information
ISBN 9780471591672
Author Michael G. Pecht
Format Hardback
Page Count 312
Imprint Wiley-Interscience
Publisher John Wiley & Sons Inc
Weight(grams) 549g
Dimensions(mm) 221mm * 158mm * 23mm
