Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve "short line distances of the cm-mm order" and "large line counts of hundreds-thousands." This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.

This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.

About the Author

Tetsuzo Yoshimura is currently a professor emeritus at Tokyo University of Technology.

Reviews

"The book describes 3D optical interconnects intended for high-performance chip and board-level communications.

In the first three chapters, it presents the fundamentals and challenges of optical interconnection and the strategies for scaling at the chip and module level. It then covers, in three chapters, the fundamentals of heterogeneous integrated photonics technologies pioneered by the author's research. The final three chapters, in a hundred pages, treat self-organized lightwave networks-or SOLNET-and develop in detail the technologies for fabrication of the interconnect along with modeling, computer simulation of the performances and experimental validation.

The book is stimulating for a variety of readers-scientists, engineers and students-and will be a useful reference for further research and development in the nascent field of optical interconnections."

Silvano Donati, University of Pavia, Italy

Book Information
ISBN 9789814877046
Author Tetsuzo Yoshimura
Format Hardback
Page Count 380
Imprint Jenny Stanford Publishing
Publisher Jenny Stanford Publishing
Weight(grams) 839g