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Lead-free Soldering Process Development and Reliability by Jasbir Bath

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9781119482031
MPN:
9781119482031
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Description

This book discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering. Among the key topics the book highlights are emerging environmental legislation, developments in process engineering, alloys, PCB surface finishes, PCB laminates, reliability assessments and standards. A practicing engineer will find the book of use as it goes into these and other topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas.

Book Information
ISBN 9781119482031
Author Jasbir Bath
Format Hardback
Page Count 528
Imprint Wiley-Blackwell
Publisher John Wiley and Sons Ltd
Weight(grams) 666g

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