Description
The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subject-including materials, design, performance characteristics, failure modes and mechanisms, and qualification and reliability assessment-with emphasis on the technology's inherent advantages and challenges.
Topics of interest include:
* Socket design and contact technologies
* Performance characteristics and material properties
* Contact failure modes and mechanisms
* Qualification testing conditions
* Qualification sequences and setup
* IEEE prediction methodology
* Theoretical calculation of contact reliability
Including a list of standards and specifications, this book is an important and timely resource for today's electronics engineers concerned with evaluating and perfecting socket design, manufacture, and use.
About the Author
WEIFENG LIU, PHD, is an Interconnect Specialist at the Business Critical Systems Organization of Hewlett Packard Company. A member of IMAPS and IEEE, he has published numerous papers and has one patent pending.
MICHAEL G. PECHT, PHD, is a professional engineer and a Fellow of IEEE and ASME. He is the founder and director of the CALCE Electronic Products and Systems Center at the University of Maryland. Among the awards he has received are the 3M Research Award, the IEEE Undergraduate Teaching Award, and the IMAPS William D. Ashman Memorial Achievement Award for his contributions in the field. He has written sixteen books on electronic product development, served as chief editor of the IEEE Transactions on Reliability, and served on the Advisory Board of IEEE Spectrum.
Reviews
"...thoroughly examines the arena of IC component sockets...it is highly recommended..." (E-STREAMS, May 2005)
Book Information
ISBN 9780471460503
Author Weifeng Liu
Format Hardback
Page Count 232
Imprint Wiley-Interscience
Publisher John Wiley & Sons Inc
Weight(grams) 454g
Dimensions(mm) 243mm * 161mm * 15mm
